Literature Review: Additive Manufacture Breakout Board

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Being transferred.

For paper:

• Overcoming Chip Shortages: Low-cost Open-source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters (2023)

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Created	January 27, 2024 by Cameron Brooks
Modified	February 5, 2024 by Cameron Brooks
Cite as	"Literature Review: Additive Manufacture Breakout Board". Appropedia. 2024. Retrieved April 29, 2024.
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