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Contents
1 Search terms
2 Articles
3 N. Sinnadurai, Plastic Packaging is Highly Reliable, IEEE Transactions on Reliability , Vol 45, No 2 , 184, 1996
4 L. Henry. SSB-1: Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications Proceedings of DMSMS conference 2000
5 K. Gilleo et. al. Thermoplastic Injection Molding: New Packages and 3D Circuits Proceedings of the 10th Electronic Circuit World Convention , Anaheim, USA. 2005
6 Y. Li and C.P. Wong, Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications, Materials Science and Engineering R 51 1–35, 2006
7 M. Gosavi Reliability testing and modeling of linear image sensor devices, PhD. thesis, State University of New York at Binghamton , 2007.
8 T. Tekin, Review of Packaging of Optoelectronic, Photonic, and MEMS Components, IEEE Journal of Selected Topics in Quantum Electronics , VOL. 17, NO. 3, MAY/JUNE 2011
Search terms
3d printing electronics package
photodiode package / photodetector package
photodiode plastic package
photodiode ceramic package
ceramic chip carrier photodiode durability
electronics packaging enviromental test
photodiode package moisture test
Articles
N. Sinnadurai, Plastic Packaging is Highly Reliable , IEEE Transactions on Reliability , Vol 45, No 2 , 184, 1996
Moisture sensors packaged in plastic
Dry heat with bias and damp heat with bias (need to pass both tests)
Heremtic packages had no lifetime advantage over plastic
Gel-coated stable after 6000h damp-heat
Temperature cycling test: extreme temperatrue variations cycled
Failure mechanisms: die cracking, voids in die attach, package fracture/crack, wirebond pad cratering, poor solder joints
Autoclaive (HAST)
Measures resistance to moisture penetration and galvanic corrosion
Temperature humidity bias
Constant temperature, elevated humidity and electrical bias
Electrolytic/galvanic corrosion, delamination, and crack propagation
Modern packages too good, takes 1000s of hours
Highly accelerated stress test
High temperature (130C), high humidity (85%) and high atmosperic pressure (up to 3 atm)
Precipitates falire mechanisms related to metallization corrosion, delamination, wirebond failure and reduced insulation resistance
Precipitates mechansims not seen during normal operation
Epoxies don't melt after curing
Injection molding can do tens of thousands of packages/hour
Molds expensive
Laser welding for sealing
Metal coating on plastic hermetic?
Adhesive should impart thermal stress and conduct heat from die to substrate
Stress from non-uniform attachment can crack die due to stress
Outgasing maybe problem
Popcorn cracking in large chips
Silver migration due to humidity
Rough surface increases adhesion
Plastic package failure rate 0.05 per million device hours in 1990
PEM = plastic encapsulated microcircuit
Wirebond failure occurs usually in temeprature cycling
Soldering can vaporize moisture in package and expand cracks
Qualitative tests used to determine failure modes, do not quantify reliability
Quantitative tests give lifetime data
Accelerated thermal cycling test
Induces thermo-mechanical stresses into package
-40C to 125C, 800 cycles, >1h/cycle
Temperature-humidity-bias stress test
Combines temperature, humidity and bias
Duration 1000 h, at 85C, 85% RH, 5.5V bias
Induce corrosion
High temperature operating test (HTOL)
Operation at maximum power level at elevated temperature
Test duration 2000h at +125C adn 5.5V bias
Weibull distribution useful in reliability studies
Failure rate expresswed as FITs => 1FIT = 1 ppm failure in 1000h
MTTF and MTBF also used, MTTF = mean time to failure, MTBF = mean time between failures
JEDEC = joint electronic device engineering council
Analysis of failed samples: retest, optical inspection, X-ray microscopy, SAM, leak test, cross-section
Package put into heated liquid -> bubbles generated at leak location
Dye penetration test = package covered in fluorescent dye and then observed under low illumination -> dye glows
SAM (scanning acoustic microscopy) detect defects, cracks etc.
Wire bonding most flexible and cost-effective
Hermetic TO-cans for photodetectors
Mechanical interface described by tensile strength, shear strength, and fatique endurance
Thermomechanical load due to different CTEs
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