This Page is Under Construction
Figures of Merit for GaN substrates
Bulk Type | Property | Units | Characterization Method | Industry range | Goal | Reference/hyperlink |
---|---|---|---|---|---|---|
GaN freestanding substrate | Bandgap(300K) |
eV |
PL |
3.44 |
||
Electron mobility |
cm2/V s |
Hall effect sensor |
~150(300K)[1] |
(1)Ammono S. A. | ||
Hole mobility |
cm2/V s |
Hall effect sensor |
13(300K) |
|||
Melting point |
K |
Thermal couple |
2573 |
|||
Lattice constants |
nm |
X-ray diffraction |
a=0.319;c=0.518 |
|||
Thermal conductivity(300K) |
W/cm K |
Time-domain thermoreflectance |
2.2-2.5 |
|||
Heat capacity |
J/mol K |
Constant presure heating |
35.3 |
|||
Elastic modulus |
GPa |
Mechanical measurement |
210 |
|||
Dislocation density |
/cm2 |
TEM and XRD |
≤5 x 106 |
|||
Sheet carrier density |
/cm2 |
SIMS |
N/A |
|||
Sheet resistance/Resistivity |
ohm-cm |
0.1-1(Undoped) |
||||
<0.01(N type) |
||||||
>106(Semi insulating) |
||||||
Doping concentration |
/cm3 |
SIMS |
~1019(N type)[1] |
(1)Ammono S. A. | ||
N/A(P type) |
||||||
Thickness |
um |
Ellipsometry |
200-475(N type) |
|||
475(Semi insulating) |
||||||
Misorientation |
deg |
SEM and TEM |
On demand |
|||
Macro defect density |
/cm2 |
TEM and XRD |
A grade<=2; B grade>2 |
|||
Bow |
um |
SEM or AFM |
<5 |
|||
Total thickness variation (TTV) |
um |
AFM(preferred) and SEM |
<10 |
|||
Surface roughness |
nm |
Profilometer and AFM |
Ra<0.2;RMS<0.5(epi ready) |
|||
Thermal expansion coeff(300K) |
/K |
Thermal elastic measurement |
along a0:5.59x10-6; along c0:7.75x10-6 |
|||
Dielectric constant(300K) |
Ellipsometry |
along a0:10.4; along c0:9.5 |
||||
Refractive index |
Ellipsometry |
2.67 at 3.38eV |
||||
Electron Effective mass |
0.22 |
|||||
GaN template on sapphire | Bandgap(300K) |
eV |
PL |
3.44 |
||
Electron mobility |
cm2/V s |
Hall effect sensor |
150(300K)* |
|||
Hole mobility |
cm2/V s |
Hall effect sensor |
13(300K) |
|||
Melting point |
K |
Thermal couple |
2573 |
|||
Lattice constants |
nm |
X-ray diffraction |
a=0.319;c=0.518 |
|||
Thermal conductivity(300K) |
W/cm K |
Time-domain thermoreflectance |
2.3(semi insulating); 1.7(HVPE material,n=1x1017) |
|||
Heat capacity |
J/mol K |
Constant presure heating |
35.3 |
|||
Elastic modulus |
GPa |
Mechanical measurement |
210 |
|||
Dislocation density |
/cm2 |
TEM and XRD |
≤1 x 108[1,2] 5 x 108-6 x 108(for N type and undoped)[3] 8 x 108(for semi insulating)[3] 8 x 107-9 x 107(for N type and undoped)[4] |
(1)Xiamen Powerway Advanced Material Co., Ltd. (2)Anhui Haibei Import & Export Co., Ltd. (3)Saint-Gobain Crystals-Photonic Materials (4)Saint-Gobain Crystals-Photonic Materials | ||
Sheet carrier density |
/cm2 |
SIMS |
N/A |
|||
Sheet resistance/Resistivity |
ohm-cm |
<0.05(Undoped)[1] |
(1)Xiamen Powerway Advanced Material Co., Ltd. (2)Anhui Haibei Import & Export Co., Ltd. | |||
<0.05(N type)[1,2] |
||||||
<1(P type)[1] |
||||||
>106(Semi insulating)[1,2] |
||||||
Doping concentration |
/cm3 |
SIMS |
~1019(N type)* 1x1018-3x1018(N type)[2] 3x1017(undoped)[2] |
(1)Xiamen Powerway Advanced Material Co., Ltd. (2)Saint-Gobain Crystals-Photonic Materials | ||
~1017(P type)[1] |
||||||
Thickness(epilayer) |
um |
Ellipsometry |
3-100(N type,undoped)[1,2,3] |
(1)Xiamen Powerway Advanced Material Co., Ltd. (2)Anhui Haibei Import & Export Co., Ltd. (3)Saint-Gobain Crystals-Photonic Materials | ||
5-100(P type)[1] |
||||||
20-90(Semi insulating)[1,2,3] |
||||||
Buffer layer(sapphire) thickness |
um |
Ellipsometry |
430[1],330[2] |
(1)Xiamen Powerway Advanced Material Co., Ltd. (2)Saint-Gobain Crystals-Photonic Materials | ||
Misorientation |
deg |
SEM and TEM |
On demand |
|||
Macro defect density |
/cm2 |
TEM and XRD |
<10 |
|||
Bow |
um |
SEM or AFM |
10-500 |
|||
Total thickness variation (TTV) |
um |
AFM(prefered)and SEM |
<10 |
|||
Surface roughness |
nm |
Profilometer and AFM |
Ra<0.2;RMS<0.5(epi ready) |
|||
Thermal expansion coeff(300K) |
/K |
Thermal elaastic measurement |
along a0:5.59x10-6; along c0:7.75x10-6 |
|||
Dielectric constant(300K) |
Ellipsometry |
along a0:10.4; along c0:9.5 |
||||
Refractive index |
Ellipsometry |
2.67 at 3.38eV |
||||
Electron Effective mass |
0.22 |
|||||
FWHM of(102)XRD arcsec |
X-ray diffraction |
<250[1], <300 |
(1)Xiamen Powerway Advanced Material Co., Ltd. | |||
FWHM of(002)XRD arcsec |
X-ray diffraction |
<150[1] |
(1)Xiamen Powerway Advanced Material Co., Ltd. |