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Integrated measurement package for 2D materials based photodetectors
Hui Xue' Aalto University, Department of Electronics and Nanoengineering
Two-dimensional materials have many novel optical properties. Graphene, as the most extensively investigated 2D material has demonstrated broadband optical absorption and medium photoresponsivity. However, due to the semimetal nature of the graphene, it based photodetectors have suffered from the very high dark current. The goal of this project is to fabricate an integrated measurement package for 2D materials (i.e. graphene) based photodetectors. This package not only can minimise the noise level of the device but can also be used as the current amplifier. After careful design, it can be utilized at commercial equipment, such as SNOM and Raman.
The package consists of a lid and a holder. In the holder, a cylinder is used to support and the four studs are used for firming of the photodetector chip. There are also exists 20 holes which are reserved for the BNC cables. The other area of the holder is used for the wire connection and to support the integrated circuit. The integrated circuit will be connected between the chip and the BNC cable by soldering. After soldering, the lid will be closed and the only exposing part is the photodetector.
Bill of Materials
- 1.3D printed lid and the holder.
- 2.20 BNC cables.
- 3.Self-made PCB board for the Photodetector chip.
- 4. Self-made integrated circuits.
- The cost of the lid and the holder are $20.
- The 20 BCN cables will cost 60 euros.
- Self-made PCB board and integrated circuits will cost 100 euros.
- 1. Print the lid the holder using the attached STL with PolyLite PLA.
- 2. Insert the BNC cables and place the chip on top of the cylinder.
- 3. Soldering the BNC cable to the chip by wire bonder and tin soldering.
- 4. Place the lid on top of the holder and use screws to firm it.
- 5. Firm the chip by another four screws.