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Authors Ismo T.S. Heikkinen
Published 2017
License CC-BY-SA-4.0
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This page describes the experiments on the chemical resistance of 3D printable FFF thermoplastics. Literature review on the topic is found here.

Experimental[edit | edit source]

List of chemicals[edit | edit source]

First, the resistance of 3D printable materials at least to the following solvents, acids and solutions is tested:

  • Deionized H2O
  • Isopropanol
  • Acetone
  • Hydrochloric acid (HCl), 37%
  • Ammonia (NH3), aqueous solution 25%
  • Hydrogen peroxide (H2O2), aqueous solution 30%
  • Nitric acid (HNO3)
  • Phosphoric acid (H3PO4)
  • Acetic acid, concentrated

These chemicals are common chemicals used in many laboratories and many semiconductor processing steps, such as in the cleaning of silicon wafers.

Chemical processes[edit | edit source]

  • Resist strip
  • RCA1 and RCA2 wafer cleaning processes, both in RT and 80°C
  • Al etch
  • Si etch
  • HF dip
  • BHF dip
  • Aqua regia
  • Piranha

Tested 3D printing filaments[edit | edit source]

ABS:

  • IC3D ABS, color: Orange, diameter: 2.85 mm

ASA:

Co-polyester:

FEP:

  • 3Dogg.com FEP, color: Transparent, diameter: 1.75 mm. Not commercially available

yet.

Nylon:

PC:

PEI:

PETG:

PETT:

PLA:

PP: