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User:Caekstru

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Craig Ekstrum
Craig Ekstrum is an undergraduate in the Michigan Tech Department of Materials Science & Engineering
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Biography[edit]

Craig is a fourth-year materials science and engineering student at Michigan Technological University with a background in R&D and product development in the polymer and semiconductor industries. He is currently engaged in research on Al additive manufacturing through the Pearce Research Group at Michigan Tech in Open Sustainability Technology (MOST). Past work with MOST includes molecular beam epitaxy (MBE) of thin films for integrating III-V semiconductors on Si substrates, and characterization of zinc oxide nano-powders.

Research Interests[edit]

  • Additive Manufacturing
  • Photovoltaics
  • Nanotechnology

Engineering Experience[edit]

Powertrain Manufacturing Intern, Ford Motor Company (May 2019 – Aug 2019)[edit]

  • Lead process development for quenching of vacuum carburized internal ring gears
  • Supported re-launch of vacuum carburization furnace through metallurgical assessments trials
  • Failure analysis of powertrain components via metallurgical examination and SEM, interfacing with product development community

Metrology Intern, Hemlock Semiconductor (May 2018 – Aug 2018)[edit]

  • Optimization of single-crystal Si solidification to reduce dislocation densities
  • Failure analysis with optical and electron microscopy, XRD, and XRF
  • Initiated manufacturing engineer/operator discussion resulting in waste savings

Research and Development Co-op, Bemis Company (Jul 2016 – Dec 2016, May 2017 – Aug 2017)[edit]

  • Technology transfer of two technology platforms from research and pilot scales to manufacturing scale
  • Developed communication skills with manufacturing facility engineers and operators through commercial and pilot scale manufacturing trials
  • Experience in polymer compounding, blown film and cast extrusion, coating/printing

Product Development Co-op, Bemis Company (Jan 2016 – July 2016)[edit]

  1. Implemented design of experiments (DOE) methodology to support product development of flexible packaging with wider ultrasonic welding window
  2. Developed novel microscopy characterization method to understand failure mechanisms of films during ultrasonic welding process, leading to a technical solution

Research Experience[edit]

Atomic Layer Deposition on 3-D Printed Polymers (Sep 2017 - Present)[edit]

  • Characterization of conformity and penetration of AlOx ALD films on 3-D printed polymers

Arc welding additive manufacturing of Al-Sc alloys (Sep 2018 – Present)[edit]

  • Al-Sc alloy development for high-strength components made through wire arc additive manufacturing (WAAM)
  • Manufacturing of alloy into wires (billet casting, Al extrusion, wire drawing, 3-D arc weld printing)

Integrating III-V Semiconductors on Si Substrates (Aug 2014 – Dec 2015)[edit]

  • Molecular beam epitaxy (MBE) growth of thin film semiconductors, metals, and oxides, with focus of integrating III-V thin films on silicon substrates for high-efficiency solar cells


Publications[edit]

Abinaya, C., et al. "Structural and optical characterization and efficacy of hydrothermal synthesized Cu and Ag doped zinc oxide nanoplate bactericides." Materials Chemistry and Physics 184 (2016): 172-182. [1]

Abinaya, C., et al. "Inhibition of growth of S. epidermidis by hydrothermally synthesized ZnO nanoplates." Materials Research Express 4.7 (2017): 075401. [2]

Abinaya, Chandrasekaran, et al. "Synthetic Method Dependent Physicochemical Properties and Electrochemical Performance of Ni‐Doped ZnO." ChemistrySelect 2.28 (2017): 9014-9023. [3]