User:Caekstru
| Name | Craig Ekstrum |
|---|---|
| Affiliations | Michigan Technological University |
| Location | |
| Nationality | |
| Groups | MOST users |
| Registered | 2014 |
Craig is a fourth-year materials science and engineering student at Michigan Technological University with a background in R&D and product development in the polymer and semiconductor industries. He is currently engaged in research on Al additive manufacturing through the . Past work with MOST includes molecular beam epitaxy (MBE) of thin films for integrating III-V semiconductors on Si substrates, and characterization of zinc oxide nano-powders.
Research Interests
[edit | edit source]- Additive Manufacturing
- Photovoltaics
- Nanotechnology
Engineering Experience
[edit | edit source]Powertrain Manufacturing Intern, Ford Motor Company (May 2019 – Aug 2019)
[edit | edit source]- Lead process development for quenching of vacuum carburized internal ring gears
- Supported re-launch of vacuum carburization furnace through metallurgical assessments trials
- Failure analysis of powertrain components via metallurgical examination and SEM, interfacing with product development community
Metrology Intern, Hemlock Semiconductor (May 2018 – Aug 2018)
[edit | edit source]- Optimization of single-crystal Si solidification to reduce dislocation densities
- Failure analysis with optical and electron microscopy, XRD, and XRF
- Initiated manufacturing engineer/operator discussion resulting in waste savings
Research and Development Co-op, Bemis Company (Jul 2016 – Dec 2016, May 2017 – Aug 2017)
[edit | edit source]- Technology transfer of two technology platforms from research and pilot scales to manufacturing scale
- Developed communication skills with manufacturing facility engineers and operators through commercial and pilot scale manufacturing trials
- Experience in polymer compounding, blown film and cast extrusion, coating/printing
Product Development Co-op, Bemis Company (Jan 2016 – July 2016)
[edit | edit source]- Implemented design of experiments (DOE) methodology to support product development of flexible packaging with wider ultrasonic welding window
- Developed novel microscopy characterization method to understand failure mechanisms of films during ultrasonic welding process, leading to a technical solution
Research Experience
[edit | edit source]Atomic Layer Deposition on 3-D Printed Polymers (Sep 2017 - Present)
[edit | edit source]- Characterization of conformity and penetration of AlOx ALD films on 3-D printed polymers
Arc welding additive manufacturing of Al-Sc alloys (Sep 2018 – Present)
[edit | edit source]- Al-Sc alloy development for high-strength components made through wire arc additive manufacturing (WAAM)
- Manufacturing of alloy into wires (billet casting, Al extrusion, wire drawing, 3-D arc weld printing)
Integrating III-V Semiconductors on Si Substrates (Aug 2014 – Dec 2015)
[edit | edit source]- Molecular beam epitaxy (MBE) growth of thin film semiconductors, metals, and oxides, with focus of integrating III-V thin films on silicon substrates for high-efficiency solar cells
Publications
[edit | edit source]Abinaya, C., et al. "Structural and optical characterization and efficacy of hydrothermal synthesized Cu and Ag doped zinc oxide nanoplate bactericides." Materials Chemistry and Physics 184 (2016): 172-182. [1]
Abinaya, C., et al. "Inhibition of growth of S. epidermidis by hydrothermally synthesized ZnO nanoplates." Materials Research Express 4.7 (2017): 075401. [2]
Abinaya, Chandrasekaran, et al. "Synthetic Method Dependent Physicochemical Properties and Electrochemical Performance of Ni‐Doped ZnO." ChemistrySelect 2.28 (2017): 9014-9023. [3]