Size of this preview: 800 × 140 pixels. Other resolution: 1,280 × 224 pixels.
Original file (1,280 × 224 pixels, file size: 75 KB, MIME type: image/jpeg)
Description of TBAF process Source: "Removing Cured Silicone Adhesive from Electronic Components." - ElectroIQ. N.p., n.d. Web. 12 Oct. 2012. <http://web.archive.org/web/20120722020245/http://www.electroiq.com/articles/ap/print/volume-15/issue-10/features/removing-cured-silicone-adhesive-from-electronic-components.html>.
I made this table.
File history
Click on a date/time to view the file as it appeared at that time.
| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 19:41, 12 October 2012 | | 1,280 × 224 (75 KB) | Anthony Konieczny (talk | contribs) | Description of TBAF process Source: "Removing Cured Silicone Adhesive from Electronic Components." - ElectroIQ. N.p., n.d. Web. 12 Oct. 2012. <http://www.electroiq.com/articles/ap/print/volume-15/issue-10/features/removing-cured-silicone-adhesive-from-ele |
You cannot overwrite this file.
File usage
The following page uses this file:
