Publication data
Type Paper
Title Open-source parametric 3-D printed slot die system for thin film semiconductor processing
Year 2018
Language English (en)
License CC-BY-SA-3.0
Cite as * L.Y. Beeker, Adam M. Pringle, Joshua M. Pearce. Open-source parametric 3-D printed slot die system for thin film semiconductor processing. Additive Manufacturing 20 (2018) 90–100. https://doi.org/10.1016/j.addma.2017.12.004 open access
Project data
Authors L.Y. Beeker
Adam M. Pringle
Joshua M. Pearce
Location Michigan, USA
Status Designed
Modelled
Prototyped
Verified
Verified by MOST
Links https://www.academia.edu/35667969/Open_source_Parametric_3_D_Printed_Slot_Die_System_for_Thin_Film_Semiconductor_Processing&#124
https://www.sciencedirect.com/science/article/abs/pii/S221486041730012X
OKH Manifest Download
Device data
Design files https://osf.io/m2zqk/
Hardware license CERN-OHL-S
Certifications Start OSHWA certification

Slot die coating is growing in popularity because it is a low operational cost and easily scaled processing technique for depositing thin and uniform films rapidly, while minimizing material waste. The complex inner geometry of conventional slot dies require expensive machining that limits accessibility and experimentation. In order to overcome these issues this study follows an open hardware approach, which uses an open source 3-D printer to both fabricate the slot die and then to functionalize a 3-D slot die printing system. Polymer materials are tested and selected for compatibility with common solvents and used to fabricate a custom slot die head. This slot die is then integrated into a 3-D printer augmented with a syringe pump to form an additive manufacturing platform for thin film semiconductor devices. The full design of the slot die system is disclosed here using an open source license including software and operational protocols. This study demonstrates that functional lab-grade slot dies may be 3-D printed using low-cost open source hardware methods A case study using NiO2 found an RMS value 0.486 nm, thickness of 17–49 nm, and a maximum optical transmission of 99.1%, which shows this additive manufacturing approach to slot die depositions as well of fabrication is capable of producing viable layers of advanced electronic materials. Using this method, a cost savings of over 17,000% was obtained when compared to commercial slot die systems for laboratories.

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    Page data
    Keywords open source, 3D printing, RepRap, manufacturing, Slot die, Thin film, Semiconductor, osat
    SDG SDG09 Industry innovation and infrastructure
    License CC-BY-SA-3.0
    Organizations MOST, MTU
    Language English ()
    Related 0 subpages, 0 pages link here
    Views 437 page views (analytics)
    Created January 10, 2018 by Joshua M. Pearce
    Last edit November 28, 2025 by Maintenance script