Literature Review: A Desktop 3D Printer for In-Situ Conductor Integration

Notes to Reader[edit | edit source]

This project is still in progress, feel free to contribute here or check out our current progress as it becomes available:

GitLab (Private)

Background[edit | edit source]

Search Strategy & Terms[edit | edit source]

Key words terms (KWT)

"term1" AND "term2"

Strategies

Searched [site] using KWT1 and KWT3

What is In-Situ Wire Integration?[edit | edit source]

The "What" of the topic. work-in-progress

Theoretical Framework[edit | edit source]

The "How" of the topic. work-in-progress

Significance and Importance[edit | edit source]

The "Why" of the topic. work-in-progress

Current State of the Art[edit | edit source]

The "When" of the topic. Review current state with an emphasis on the development of the field over time. work-in-progress

Relevant Stakeholders[edit | edit source]

The "Who" of the topic. work-in-progress

Applicability and Context[edit | edit source]

The "Where" of the Topic. work-in-progress

Literature[edit | edit source]

TODO[edit | edit source]

Software integration
- Firmware modification (Printer Controller)
  - Adapt open source 3DP firmware, most likely is RepRap Firmware for DUET3 Controllers
  - Modify firmware to utilize the controller’s additional IO pins, stepper drivers, and other peripherals to realize the extrusion and embedding of wire with a rotational toolhead
    - Consists of changing the controller’s configuration file (in G-code) FIRST and THEN potentially changing the actual source code (in C++) if there is functionality on the controller that cant be configured by G-code.
- G-Code commands
  - Interpreting standard commands for normal 3DP operations
  - Developing custom commands for wire embedding related operations
- Slicer software
  - Manipulate common slicer features to print “PCB traces”
  - Inserting custom G-Code
Mechanical Properties of Embedded Wire, some things to consider…
- Flexibility and bend radius
  - Gauge and ductility of wire material
  - Effects on ability to conform to print contours
- Adhesion strength
  - Bonding between wire and plastic
  - Risk of delamination/splitting
  - Surface treatments to improve adhesion
- Relative hardness and modulus
  - Strain transfer and bonding
  - Matching mechanical properties
- Potential knowledge gaps
  - Lack of data on wire embeddability for different plastics
  - Need for custom nozzle designs optimized for wire embedding
  - Effects of embedment on mechanical performance of printed parts
Printing process parameters
- Residual stress
  - Wire embedding induces stresses
  - Need to characterize residual stresses
- Print settings
  - Temperature, nozzle design, layer height
  - Effects on wire embedding process
  - Optimize for wire integration
- Gap formation
  - Potential for air pockets around wire
  - Minimize with optimized settings
Performance validation (testing the manufactured product)
- Pull-out testing
  - Quantify adhesion strength
  - Determine safe pull force
- Microscopy
  - Reveal gaps, delamination issues
  - Cross-sectional analysis
- Flex testing
  - Assess durability under bending
- Print orientation
  - Reveal anisotropic effects
  - Test different orientations
Knowledge Gaps & Possible Considerations
- Thermal, and Electrical Characterizations of existing methods such as:
  - conducting FFF → https://link.springer.com/article/10.1007/s00170-020-06318-2
  - ink/paste → https://www.osti.gov/servlets/purl/1148252
  - Solder
- What are suitable resistances, parasitic inductance/capacitance values for low power embedded circuits ?
- Vias (https://ieeexplore.ieee.org/document/8107678), interconnects, connectors, solder pads, ground planes etc??
- Other open source 3d printing toolhead projects, like the Yestruder(needs link)
- Hot wire anemometry
- Welding machines and welding AM
- Concrete 3d printing
- How does nozzle geometry affect the wire embedding process if at all?
- Is encapsulating wire with 3DP plastic sufficient (https://hackaday.com/2014/05/25/adding-copper-wire-to-a-3d-print/) to act as “insulator”
  - consider dielectric testing
- Safety of software?? → https://link.springer.com/chapter/10.1007/978-3-031-20137-0_6
- How do we distinguish between G1 and G2/G3 moves and should they be processed differently for generating rotation commands ?
- Does the material substrate have good dielectric properties?

This is the review template used:

Paper/Website/Source Title[edit | edit source]

Zotero citation field with the URL (DOI preferred).

Each top-level point should be a clear and concise key item from the source (methodology, info, design, gap, etc.)
- Sub points are to be concise explanations of critical aspects of the key item
- Should not be a copy and paste of info but rather an interpretation of what parts are relevant and why, selective copy & paste of relevant snippets is fine.

Conductive / Electronics Additive Manufacturing[edit | edit source]

A Survey of 3D Printing Technologies as Applied to Printed Electronics[edit | edit source]

Persad, J., & Rocke, S. (2022). A Survey of 3D Printing Technologies as Applied to Printed Electronics. IEEE Access, 10, 27289–27319. https://doi.org/10.1109/ACCESS.2022.3157833

Really good background info and prior SOTA. Need to review still

3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect[edit | edit source]

Kim, C., Espalin, D., Liang, M., Xin, H., Cuaron, A., Varela, I., Macdonald, E., & Wicker, R. B. (2017). 3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect. IEEE Access, 5, 25286–25294. https://doi.org/10.1109/ACCESS.2017.2773571

Interlayer connection allows for improved routing density and better leverage geometries for 3DP, Cloven Foil Via approach
- crossover can easily be achieved by adding additional layers, I think this is easy enough to do
For vertical interconnects, a solid metal conductor is just as important as horizontal wire traces to be solid metal as well
Method:
- Designer specifies via location in PCB software, this paper did it manually
  - no solution exists yet but proposed that software needs to be made to determine placement orientation of vias and placement cavity and integration of that with mechanical CAD to export to slicer
- Print substrate, embed wires, and pause at locations where vias needed (pause @ higher layer)
- Introduce cavity for Cloven Foil Via, whose normal plane is parallel to the parallel traces at different depths - coupling capacitance/inductance issues
  - Wires that are non parallel, cloven foil via's normal plane should "split difference" between the 2 wires' angles , I.e theta between 2 wires / 2
  - custom cloven via widths are cut on demand
Cloven Foil Vias require tight tolerances and can't be too narrow or too wide as it can lead to open circuits from movement over time
Frequency and "S" parameter testing on these cloven foil vias

A desktop 3D printer with dual extruders to produce customised electronic circuitry[edit | edit source]

Butt, J., Onimowo, D. A., Gohrabian, M., Sharma, T., & Shirvani, H. (2018). A desktop 3D printer with dual extruders to produce customised electronic circuitry. Frontiers of Mechanical Engineering, 13(4), 528–534. https://doi.org/10.1007/s11465-018-0502-1

E Paint extruder and filament extruder "communicate" with each other via ICSP port of Arduino Uno
- Outdated and crude methodology (Developed for the Prusa Mendel i2)
- Paint extruder is just ON/OFF with timing
- Arduino Uno lol
G-code is also very crude where a totally separate G-code is used to turn extruder on or off (G100/101)
- Didn’t mention in their methods but they used Pronterface for regular plastic part and some kind of custom G-code script with G100/101 commands for paste extruder was sent after
Ink past extrusion is based on a viscous non newtonian fluid model which requires non linear, real time control to get consistent line widths, not feasible
- their work around was using CFD which isn't practical outside a research setting

3D Printing for the Rapid Prototyping of Structural Electronics[edit | edit source]

Macdonald, E., Salas, R., Espalin, D., Perez, M., Aguilera, E., Muse, D., & Wicker, R. B. (2014). 3D Printing for the Rapid Prototyping of Structural Electronics. IEEE Access, 2, 234–242. https://doi.org/10.1109/ACCESS.2014.2311810

3D PCBs not as good as conventional PCBs in terms of reliability,surface finish, color, texture
- not a major priority in aerospace, biomed industries as reliability may be the only important barrier
Lack of software that allows for 3DP PCBs
- process is manual like using CAD like Solidworks, i.e no automated routing, pick and place
- limits 3DP PCBs to very basic circuits
- use existing ECAD by treating 3D shape as 2D surface and then "deform" to final 3D shape
Ink deposition w/ printed cavities and UV curable adhesive
- "SL process dictates the routing density based on the laser resolution rather than the resolution of the micro-dispensing system or the viscosity of the inks"
- achieved line pitches of 560 microns
6 sided electronic gaming die was SLA fabricated in 6 hrs for printing and 24hrs to populate with components and cure ink

*** I read the wrong paper, the more technical paper i found later on here: https://doi.org/10.1007/s00170-014-5717-7 ***

Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending[edit | edit source]

Hong, F., Myant, C., & Boyle, D. E. (2021). Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending. Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems, 1–10. https://doi.org/10.1145/3411764.3445469

To be reviewed.

Expansion of the Fused Filament Fabrication (FFF) Process Through Wire Embedding, Automated Cutting, and Electrical Contacting[edit | edit source]

Ziervogel, F., Boxberger, L., Bucht, A., & Drossel, W.-G. (2021). Expansion of the Fused Filament Fabrication (FFF) Process Through Wire Embedding, Automated Cutting, and Electrical Contacting. IEEE Access, 9, 43036–43049. https://doi.org/10.1109/ACCESS.2021.3065873

PRIORITY. To be reviewed. Very comprehensive.

Joule Heating Wire Embedding - 3D Printing in Action[edit | edit source]

UTEP Keck Center (Director). (2014, November 3). Joule Heating Wire Embedding—3D Printing in Action. https://www.youtube.com/watch?v=83HyPrfd-7s

To be reviewed.

Intermittent Embedding of Wire into 3D Prints for Wireless Power Transfer[edit | edit source]

Kim, C., Sullivan, C., Hillstrom, A., & Wicker, R. (2021). Intermittent Embedding of Wire into 3D Prints for Wireless Power Transfer. International Journal of Precision Engineering and Manufacturing, 22(5), 919–931. https://doi.org/10.1007/s12541-021-00508-y

FINISH REVIEWING!!!
- incomplete but this paper also has bountiful information on the mechanics of wire embedding, really good for wire mechanics and extrusion
transition from layer to layer in 3DP provides opportunity to embed wire via a separate but integrated process.
current techniques can't supply enough power that can be applied to embedded circuits #gap/limitation -->limits use cases of device and negatively affects design choices
current PPCBs require ext. power/embedded energy storage device like a battery
- embedding battery embedded in the part causes design difficulties and hard to replace when it dies
- connectors for ext. battery can bend, erode, or other mode of failure
  - maybe use better connectors and structural support??? Design for 3DP Principles
  - this paper addresses the issue by embedding antennae capable of wireless power transfer (WPT)
    - "This reduces the required effort compared with embedded connectors, batteries, or other methods of supplying power to the electronic system."
current layer of printed plastic or substrate can be damaged during the process of embedding traditional conductive materials like solid metal wire via continuous conductive heat
- To address above problem, the methodology this paper uses is to embed traditional copper wire onto printed plastic via heat application and pressure at regular intervals using a FFF nozzle -->"embedding instances" method
- areas of substrate at risk of being damages via heat or pressure is at corners along the print tool path
- prevents heat transfer along copper wire but still melt plastic sufficiently to create bond
Coils previously produced via depositing high performance conductive ink requires curing temps >850degC which is a lot more than what 3dp plastics can handle. Therefore ink cant cure properly #gap/limitation
Wire embedding involves heating and pushing wire into printed substrate and then secured when wire cools
- Heating can be via friction heating via ultrasound movement, direct heating via conductive heater, joule heating, etc.
- Important to apply heat to the wire NOT the substrate to avoid damage
- We will need to explore ideal temperatures, speeds, forces and layer heights
Paper finds that conductive heat transfer from embedding tool along the copper wire can adversely affect adhesion of previously laid wire and tension of said wire can pull out #gap/limitation
- also found that direction changes of embedding tool, and start and stop of embedding process were sources of improper adhesion and failure to embed successfully
- proposes intermittent embedding by allowing sufficient cooling time
- We can also use this strategy however it would but would require post processing g-code or doing some other kind of "tricks" with a slicer
Tool Pressure Dynamic Analysis
- in Y axis (normal to substrate plane): $f_{y}=-\sin \theta \cdot T_{w}+\rho _{s}\cdot r_{w}^{2}\pi \cdot g+\int _{0}^{l_{rs}}2\cdot r_{w}\cdot \sigma _{ys}\,dl$ $f_{y}=-\sin \theta \cdot T_{w}+\rho _{s}\cdot r_{w}^{2}\pi \cdot g+\int _{0}^{l_{rs}}2\cdot r_{w}\cdot \sigma _{ys}\,dl$
  - where $\theta$ is the angle between the substrate and the wire, $T_{w}$ is the tension force of the wire from the wire tensioner, caused by inertia in the filament spool, $\rho _{s}$ is the substrate density, $r_{w}$ is the radius of the wire, $t_{T}$ is the contact length with the embedding tool, $g$ is acceleration due to gravity, $t_{T_{s}}$ is the length of the wire that stays between unmolten rigid substrate and under the embedding tool, $\sigma _{ys}$ is the compression yield stress of the substrate, and $l$ is the position on the wire that stays between unmolten rigid substrate under the embedding tool.

Fraunhofer IWU Wire Extruder[edit | edit source]

To be reviewed;
- https://www.iwu.fraunhofer.de/content/dam/iwu/de/documents/Presse/PM-2022-IWU-Formnext.pdf
- http://sculpman.com/product
- https://www.youtube.com/watch?v=lTUTvcp7jVg
- https://idw-online.de/de/news804452
- https://www.idw-bilder.de/id/00004479
- https://www.iwu.fraunhofer.de/de/volltextsuche.html?_charset_=UTF-8&numberResults=10&page=1&scope=IWU&lang=de&queryString=wire
- https://www.iwu.fraunhofer.de/content/dam/iwu/de/documents/Presse/PM-2022-IWU-Formnext.pdf
- https://www.iwu.fraunhofer.de/de/presse-und-medien/presseinformationen/PM-2023-IWU-Umformtechnik-macht-E-Motoren-leistungsstaerker-und-effizienter.html
- https://www.idw-bilder.de/thumb.php/00004479.jpg?eJwljL0KAjEQhN9l6isSE43ZTtIoeAqeoFaSc5PKSr1KfHfHuLD7MT_sG2kFqfn-LB3SGgKQZ4glLg3bDcQRO4ZapiuXnZ7KcLwP8SePrTtAZrwJ4on-7zF6PSb-Pw3NOECWxnTYUyLY6jXmua0aXSilxOAW403HnG0Mqvh8AVyHJ_k~

Development of an Automated Ultrasonic Wire Embedding Process for use with Material Extrusion Additive Manufacturing and Rapid Electronics Fabrication[edit | edit source]

Martinez, N. L. (2020). Development of an Automated Ultrasonic Wire Embedding Process for Use with Material Extrusion Additive Manufacturing and Rapid Electronics Fabrication. ETD Collection for University of Texas, El Paso, 1–76. https://scholarworks.utep.edu/dissertations/AAI28261188

To be reviewed.

Expansion of the Fused Filament Fabrication (FFF) Process Through Wire Embedding, Automated Cutting, and Electrical Contacting[edit | edit source]

Ziervogel, F., Boxberger, L., Bucht, A., & Drossel, W.-G. (2021). Expansion of the Fused Filament Fabrication (FFF) Process Through Wire Embedding, Automated Cutting, and Electrical Contacting. IEEE Access, 9, 43036–43049. https://doi.org/10.1109/ACCESS.2021.3065873

To be reviewed.

Development Of The Thermal Wire Embedding Technology For Electronic And Mechanical Applications On Fdm-Printed Parts[edit | edit source]

Marquez, D. A. (n.d.). Development Of The Thermal Wire Embedding Technology For Electronic And Mechanical Applications On Fdm-Printed Parts. https://scholarworks.utep.edu/open_etd/887/

To be reviewed.

Development Of A Desktop Material Extrusion 3d Printer With Wire Embedding Capabilities[edit | edit source]

Motta, J. (2018). Development Of A Desktop Material Extrusion 3d Printer With Wire Embedding Capabilities. Open Access Theses & Dissertations. https://scholarworks.utep.edu/open_etd/125

To be reviewed.

CAN Bus: The Future of Additive Manufacturing (3D Printing)[edit | edit source]

Chin, J.-C., Thapliyal, H., & Cultice, T. (2022). CAN Bus: The Future of Additive Manufacturing (3D Printing). IEEE Consumer Electronics Magazine, 1–6. https://doi.org/10.1109/MCE.2022.3216944

CAN is attractive due to its ability to integrate modular functionality, lower part and development costs and fast data payloads --> "...integrity based design"
- DUET3 capable of CAN thus allowing for modular tool heads each with their own controller and plug and play capability and all in one solutions
Advantages of the CAN and DUET controller demonstrated by
- 3DP with built in Tensile Testing Machine for Bed Adhesion:
  - https://www.sciencedirect.com/science/article/pii/S2468067222000037#:~:text=The%20measurement%20device%20described%20here,under%20nearly%20real%20process%20conditions.
- Design and Implementation of Rotational Print Heads to Control Fiber Orientation in Material Extrusion Additive Manufacturing; https://trace.tennessee.edu/utk_gradthes/6097/
  - used a DUET2 board for extruder and rotation axis but a Hyrel 3D Hydra control board for XYZ axis
  - Seems like it is possible to communicate DUET controller with an existing 3DP controller that has CAN capability or is able to interface with a CAN transceiver
Growing topic of interest within the aerospace industry for use with aerospace vehicles and manufacturing equipment
- Adoption can result in a more advanced, multifunctional robust manufacturing machine that is highly modular and up-gradable.
There are also security risks with CAN that need to be considered; risk mitigation
Takeaway: While it would require the user to swap their whole electronic controller, it would ultimately lead to an easier integration, higher modularity, as well as a simplified setup with less wires which is a huge benefit for a tool head that will be incorporating more electronics than a normal 3DP extruder

CAN bus Reduce the wires of your 3D printers[edit | edit source]

CAN bus Reduce the wires of your 3D printers. (n.d.). Retrieved August 13, 2023, from https://hackaday.io/project/181669-can-bus-reduce-the-wires-of-your-3d-printers

CAN results in cleaner setup, reduced noise, less weight and simplified wiring
This specific PANDA CAN tool board is only compatible with ESP32/STM32 based 3DP controllers, specifically 2.
- while open source, it still requires the user to change control boards or program controller firmware to accept the tool board which it has never been tested on for compatibility
- This makes DUET is more attractive

Wire Embedding 3D Printer[edit | edit source]

Bayless, J., Chen, M., & Dai, B. (2010). Wire Embedding 3D Printer. https://reprap.org/mediawiki/images/2/25/SpoolHead_FinalReport.pdf

To be reviewed.

Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics[edit | edit source]

Bournias-Varotsis, A., Han, X., Harris, R. A., & Engstrøm, D. S. (2019). Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics. Additive Manufacturing, 29, 100799. https://doi.org/10.1016/j.addma.2019.100799

To be reviewed.
- Provides some good characterization info and design recommendations.

Complex 3D Printing Processes[edit | edit source]

G-Code Generation For Multi-Process 3D Printing[edit | edit source]

Bailey, C. P. (n.d.). G-code generation for multi-process 3D printing [M.S., The University of Texas at El Paso]. Retrieved August 14, 2023, from https://www.proquest.com/docview/1870046077/abstract/6309B9B447944ECPQ/1

To be reviewed and classified.
- Important as it basically parallels what we want to do with post processing to integrate the rotational axis.

Testing and Validation[edit | edit source]

Device for measuring part adhesion in FFF process[edit | edit source]

Laumann, D., Spiehl, D., & Dörsam, E. (2022). Device for measuring part adhesion in FFF process. HardwareX, 11, e00258. https://doi.org/10.1016/j.ohx.2022.e00258

Successful use case of DUET controller and CAN in order to extend the functionality of a 3D printer so it can measure adhesion forces of a part to the bed
- ease of configuration requiring absolutely no source code (C++) modification
- online config tool for DUET allows for easy implementation for specific hardware setups
- we should be able to do the same without any source code modification

Fused filament fabrication of commercial conductive filaments: experimental study on the process parameters aimed at the minimization, repeatability and thermal characterization of electrical resistance[edit | edit source]

Stano, G., Di Nisio, A., Lanzolla, A. M., Ragolia, M., & Percoco, G. (2020). Fused filament fabrication of commercial conductive filaments: Experimental study on the process parameters aimed at the minimization, repeatability and thermal characterization of electrical resistance. The International Journal of Advanced Manufacturing Technology, 111(9), 2971–2986. https://doi.org/10.1007/s00170-020-06318-2

conductive filaments have high electrical resistance and high variation between the same sensing elements --difficult to manufacture repeatedly
2^3 Factorial Plan used to identify suitable printing parameters, then another 2^3 Factorial plan used for sensor geometry
- We can potentially used this method for our printing parameters
- maximization/minimization objective that we should identify and what our variables should be
- split design parameters from printing parameters, (design params being the geometry of the part, etc)
Takeaway: Need to find a suitable application which can demonstrate the superiority of wire embedding vs other techniques. Wire embedding doesn't seem applicable for piezoelectric sensing elements as outlined in this paper

Bibliography[edit | edit source]

Insert auto-generated Zotero list

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Authors	Cameron Brooks
License	CC-BY-SA-4.0
Language	English (en)
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Created	February 1, 2024 by Cameron Brooks
Modified	February 5, 2024 by Cameron Brooks
Cite as	Cameron Brooks (2024). "Literature Review: A Desktop 3D Printer for In-Situ Conductor Integration". Appropedia. Retrieved April 29, 2024.
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