{"id":72970,"key":"Electropolishing_of_copper_literature_review","title":"Electropolishing of copper literature review","latest":{"id":1207901,"timestamp":"2025-11-27T23:06:44Z"},"content_model":"wikitext","license":{"url":"https://www.appropedia.org/Appropedia:Copyrights","title":"CC-BY-SA-4.0"},"source":"{{L3999 notice}} {{MOST literature review notice}}\n\n== Articles ==\n\n== Keywords ==\n\n== Google scholar ==\n\n* electropolishing\n* copper electropolish\n* copper electropolishing phosphoric acid\n\n== Articles ==\n\n=== M. Datta and D. Landolt, “Fundamental aspects and applications of electrochemical microfabrication,” Electrochimica Acta, vol. 45, no. 15–16, pp. 2535–2558, 2000. ===\n\n* History: started 50yrs ago\n* e.polish = anodic w/ dissolution & leveling & brightening (anode = working)\n* primary & secondary current distribution -> Wagner's law\n* Uniformity -> anode-cathode distance or additives\n* Current density = major factor -> geometry\n\n=== D. Landolt, “Fundamental aspects of electropolishing,” Electrochim. Acta, vol. 32, no. 1, pp. 1–11, 1987. ===\n\n* Levelling & brightening (> 1um, < 1um, think of visible light)\n* Transport limiting -> microsmoothing\n* Two mass transport mechanisms, dissolution limited & acceptor limited\n* Limiting-current density\n\n=== D. Landolt, P. F. Chauvy, and O. Zinger, “Electrochemical micromachining, polishing and surface structuring of metals: Fundamental aspects and new developments,” Electrochim. Acta, vol. 48, no. 20–22, pp. 3185–3201, 2003. ===\n\n* Pitting vs brightening\n* Oxide layer -> unstable -> polishing (high voltage usually) (contradiction to later?)\n* Initial phase charge small vs total charge -> good polish (high voltage...)\n\n=== J. B. Mathieu, “Electropolishing of Titanium in Perchloric Acid-Acetic Acid Solution,” J. Electrochem. Soc., vol. 125, no. 7, p. 1044, 1978. ===\n\n* Anode potential vs oxide layer thickness\n* Breakdown -> polishing (contradiction to later?)\n\n=== R. Vidal and a C. West, “Copper Electropolishing in Concentrated Phosphoric-Acid .1. Experimental Findings,” J. Electrochem. Soc., vol. 142, no. 8, pp. 2682–2689, 1995. ===\n\n* Good quick history\n* Rotating electrode -> larger limiting current -> theory (Tribollet & Newman)\n\n=== R. Vidal and a C. West, “Copper Electropolishing in Concentrated Phosphoric-Acid .1. Experimental Findings,” J. Electrochem. Soc., vol. 142, no. 8, pp. 2682–2689, 1995. ===\n\n* Current limiting region\n* Potential surge after a while -> bad\n* Too low current density -> no boundary layer\n* Good schematic...\n\n=== D. Landolt, P. F. Chauvy, and O. Zinger, “Electrochemical micromachining, polishing and surface structuring of metals: Fundamental aspects and new developments,” Electrochim. Acta, vol. 48, no. 20–22, pp. 3185–3201, 2003. ===\n\n* Loooots of stuff (and new!)\n* CV curve w/ etching, passivation layer, polishing, pitting...\n* Copper EP electrolytes w/ current & voltage ranges\n* Diffusion dominated -> agitation (rotation) makes this better -> higher limiting current\n* Theoretical stuff: resistance, diffusion phenomenon, acceptor theory, passivation, ionic absorption\n* Applications\n\n{{Page data\n| license = CC-BY-SA-3.0\n}}"}