Introduction
Physical vapor deposition (PVD) is a engineering process to describe a variety of methods to physically deposit eposit films onto various surfaces. T
Physical vapour deposition (PVD) is fundamentally a vaporisation coating technique, involving transfer of material on an atomic level. It is an alternative process to electroplating
The process is similar to chemical vapour deposition (CVD) except that the raw materials/precursors, i.e. the material that is going to be deposited starts out in solid form, whereas in CVD, the precursors are introduced to the reaction chamber in the gaseous state.
It incorporates processes such as sputter coating and pulsed laser deposition (PLD).
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