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'''Summary Notes:'''
'''Summary Notes:'''


===http://jtc.sagepub.com/content/14/1/20.short Metal Powder-Filled Polyethylene Composites. V. Thermal Properties<ref>Sofian, N. M., et al. "Metal powder-filled polyethylene composites. V. Thermal properties." Journal of Thermoplastic Composite Materials 14.1 (2001): 20-33.</ref>
'''Abstract:''' Thermal properties—such as thermal conductivity, thermal diffusivity, and specific heat—of metal (copper, zinc, iron, and bronze) powder-filled high-density polyethylene composites are investigated experimentally in the range of filler content 0-24% by volume. Experimental results show a region of low particle content, 0-16% by volume, where the particles are distributed homogeneously in the polymer matrix and do not interact with each other. In this region most of the thermal conductivity models for two-phase systems are applicable. At higher particle content, the filler tends to form agglomerates and conductive chains resulting in a rapid increase in thermal conductivity.
'''Keywords:''' Metal-filled polymers, metal fillers, thermal conductivity, high-density polyethylene,
'''Summary Notes:'''


===[http://www.sciencedirect.com/science/article/pii/S1359835X05002782 Enhanced thermal conductivity of polymer composites filled with hybrid filler<ref>Geon-Woong Lee, Min Park, Junkyung Kim, Jae Ik Lee, Ho Gyu Yoon, Enhanced thermal conductivity of polymer composites filled with hybrid filler, Composites Part A: Applied Science and Manufacturing, Volume 37, Issue 5, May 2006, Pages 727-734, ISSN 1359-835X, http://dx.doi.org/10.1016/j.compositesa.2005.07.006. (http://www.sciencedirect.com/science/article/pii/S1359835X05002782)</ref>]===
===[http://www.sciencedirect.com/science/article/pii/S1359835X05002782 Enhanced thermal conductivity of polymer composites filled with hybrid filler<ref>Geon-Woong Lee, Min Park, Junkyung Kim, Jae Ik Lee, Ho Gyu Yoon, Enhanced thermal conductivity of polymer composites filled with hybrid filler, Composites Part A: Applied Science and Manufacturing, Volume 37, Issue 5, May 2006, Pages 727-734, ISSN 1359-835X, http://dx.doi.org/10.1016/j.compositesa.2005.07.006. (http://www.sciencedirect.com/science/article/pii/S1359835X05002782)</ref>]===

Revision as of 14:30, 11 February 2016

Background

This page is dedicated to the literature review of 3D printable conductive filaments.

Literature

===[http://www.sciencedirect.com/science/article/pii/S0014305702000642 Electrical and thermal conductivity of polymers filled with metal powders[1]

Abstract: The electrical and thermal conductivity of systems based on epoxy resin (ER) and poly(vinyl chloride) (PVC) filled with metal powders have been studied. Copper and nickel powders having different particle shapes were used as fillers. The composite preparation conditions allow the formation of a random distribution of metallic particles in the polymer matrix volume for the systems ER–Cu, ER–Ni, PVC–Cu and to create ordered shell structure in the PVC–Ni system. A model is proposed to describe the shell structure electric conductivity. The percolation theory equation σ∼(ϕ−ϕc)t with t=2.4–3.2 (exceeding the universal t=1.7 value) holds true for the systems with dispersed filler random distribution, but not for the PVC–Ni system. The percolation threshold ϕc depends on both particle shape and type of spatial distribution (random or ordered). In contrast to the electrical conductivity, the concentration dependence of thermal conductivity shows no jump in the percolation threshold region. For the description of the concentration dependence of the electrical and thermal conductivity, the key parameter is the packing factor F. F takes into account the influence of conductive phase topology and particle shape on the electrical and thermal conductivity.

Keywords: Copper powders, Nickel powders, Metal powders

Summary Notes:

===http://jtc.sagepub.com/content/14/1/20.short Metal Powder-Filled Polyethylene Composites. V. Thermal Properties[2]

Abstract: Thermal properties—such as thermal conductivity, thermal diffusivity, and specific heat—of metal (copper, zinc, iron, and bronze) powder-filled high-density polyethylene composites are investigated experimentally in the range of filler content 0-24% by volume. Experimental results show a region of low particle content, 0-16% by volume, where the particles are distributed homogeneously in the polymer matrix and do not interact with each other. In this region most of the thermal conductivity models for two-phase systems are applicable. At higher particle content, the filler tends to form agglomerates and conductive chains resulting in a rapid increase in thermal conductivity.

Keywords: Metal-filled polymers, metal fillers, thermal conductivity, high-density polyethylene,

Summary Notes:

Enhanced thermal conductivity of polymer composites filled with hybrid filler[3]

Abstract: This study aims at investigating package materials based on polymer matrix for microelectronics. The next generation package materials are expected to possess high heat dissipation capability in addition to low coefficient of thermal expansion (CTE) as the accumulated heat from high performance electronic devices should be removed for proper operation. In this study, various inorganic fillers including aluminum nitride (AlN), wollastonite, silicon carbide whisker (SiC) and boron nitride (BN) with different shape and size were used alone or in combination to prepare thermally conductive polymer composites. In case of AlN, titanate coupling agent was used for the surface treatment of fillers. The use of hybrid filler was found to be effective in increasing thermal conductivity of the composite probably due to the enhanced connectivity offered by structuring filler with high aspect ratio in hybrid filler. For given filler loading, the use of larger particle and surface treated filler resulted in composite materials with enhanced thermal conductivity. The surface treatment of filler also allowed producing the composites with lower CTE.

Keywords: Hybrid, Thermal process, Powder processing, Thermal properties, Thermal analysis

Summary Notes:

References

  1. Ye.P. Mamunya, V.V. Davydenko, P. Pissis, E.V. Lebedev, Electrical and thermal conductivity of polymers filled with metal powders, European Polymer Journal, Volume 38, Issue 9, September 2002, Pages 1887-1897, ISSN 0014-3057, http://dx.doi.org/10.1016/S0014-3057(02)00064-2. (http://www.sciencedirect.com/science/article/pii/S0014305702000642)
  2. Sofian, N. M., et al. "Metal powder-filled polyethylene composites. V. Thermal properties." Journal of Thermoplastic Composite Materials 14.1 (2001): 20-33.
  3. Geon-Woong Lee, Min Park, Junkyung Kim, Jae Ik Lee, Ho Gyu Yoon, Enhanced thermal conductivity of polymer composites filled with hybrid filler, Composites Part A: Applied Science and Manufacturing, Volume 37, Issue 5, May 2006, Pages 727-734, ISSN 1359-835X, http://dx.doi.org/10.1016/j.compositesa.2005.07.006. (http://www.sciencedirect.com/science/article/pii/S1359835X05002782)
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