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''<sup>1</sup> Dynatech R/D Company, Research comissioned by US DOE and Oak Ridge National Labratory''' | ''<sup>1</sup> Dynatech R/D Company, Research comissioned by US DOE and Oak Ridge National Labratory''' | ||
- Discribes several reasons for the occurence of thermal bridges (high thermal conductivity of structural elements, connections, and enclosure penetrations, as well as geometric effects, and faulty installation) | - Discribes several reasons for the occurence of thermal bridges (high thermal conductivity of structural elements, connections (high strength often means high conductivity), and enclosure penetrations, as well as geometric effects, and faulty installation).<br /> | ||
- Performed an intensive literature review of over 400 sources including topics in thermography, energy audits, in-situ measurements, and condensation.<br /> | - Performed an intensive literature review of over 400 sources including topics in thermography, energy audits, in-situ measurements, and condensation.<br /> | ||
- Based on the literature review the paper states that thermal bridges can have up to a 20% reduction in wall resistivity.<br /> | - Based on the literature review the paper states that thermal bridges can have up to a 20% reduction in wall resistivity.<br /> |