Figures of Merit for GaN substrates

Bulk Type Property Units Characterization Method Industry range Goal Reference/hyperlink
GaN freestanding substrate Bandgap(300K)
eV
PL
3.44[1,2]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
(2)Xiamen Powerway Advanced Material Co. Ltd.
Electron mobility(300K)
cm2/V s
Hall effect sensor
~150[1],~250[2]
1350[4]
150(for n=1019)[3]
240(for n=1018)[3]
500(for n=1017)[3]

(1)Ammono S. A.
(2)Ammono S. A.
(3)Kyma Technologies
(4)http://www.springer.com/materials/book/978-3-642-04828-9
Hole mobility(300K)
cm2/V s
Hall effect sensor
13[1]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
Melting point
K
Thermal couple
2573[1]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
Lattice constants
nm
X-ray diffraction
a=0.319;c=0.518[1]
a=0.3189;c=0.5185[2]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
(2)Kyma Technologies
Thermal conductivity(300K)
W/cm K
Time-domain thermoreflectance
2.0-2.4[1]

(1)Kyma Technologies
Heat capacity
J/mol K
Constant presure heating
35.3[1]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
Elastic modulus
GPa
Mechanical measurement
210[1]

(1)http://www.springer.com/materials/book/978-3-642-04828-9

Dislocation density
/cm2
TEM and XRD
~5x104[1]
≤5 x 106[2]
1x107-4x107[3]

(1)Ammono S. A.
(2)Lux Material Co., Ltd.
(3)Saint-Gobain Crystals - Photonic Materials
Sheet carrier density
/cm2
SIMS
N/A


Sheet resistance/Resistivity
ohm-cm

0.1-1(Undoped)[3]

(1)Ammono S. A.
(2)Ammono S. A.
(3)Lux Material Co., Ltd.
(4)Saint-Gobain Crystals - Photonic Materials
10-3-10-2(N type)[1]
<0.01(N type)[3]
<0.03[4]

109-1012[2]
>106(Semi insulating)[3]

Carrier concentration
/cm3
SIMS
~1019(N type)[1]
3x1017(N type)[2]
1x1018-3x1018(N type)[3]

(1)Ammono S. A.
(2)Ammono S. A.
(3)Saint-Gobain Crystals - Photonic Materials
N/A(P type)

Thickness
um
Ellipsometry
300-400(N type)[1,4]
475[3]
200-475(N type)

(1)Ammono S. A.
(2)Ammono S. A.
(3)Lux Material Co., Ltd.
(4)Saint-Gobain Crystals - Photonic Materials
>300[2]
475(Semi insulating)[3]

Misorientation
deg
SEM and TEM
On demand


Macro defect density
/cm2
TEM and XRD
A grade<=2; B grade>2


Bow
um
SEM or AFM
<10[1]
<20[2]
<5

(1)Ammono S. A.
(2)Lux Material Co., Ltd.
Total thickness variation (TTV)
um
AFM(preferred) and SEM
<40[1],~20[2]
<15[3]
<10

(1)Ammono S. A.
(2)Ammono S. A.
(3)Lux Material Co., Ltd.
Surface roughness
nm
Profilometer and AFM
Ra<0.2[1];RMS<0.5(epi ready)

(1)Lux Material Co., Ltd.
Thermal expansion coeff(300K)
/K
Thermal elastic measurement
along a0:5.59x10-6; along c0:7.75x10-6[1]

(1)Kyma Technologies
Dielectric constant(300K)

Ellipsometry
along a0:10.4; along c0:9.5[1]

(1)Kyma Technologies
Refractive index

Ellipsometry
2.67 at 3.38eV[1]

(1)Kyma Technologies
Electron Effective mass


0.22[1]

(1)Kyma Technologies
FWHM of X-ray rocking curve,epi-ready surface at 100 µm x 100 µm slit)
arcsec
X-ray diffraction
~20[1]

(1)Ammono S. A.
GaN template on sapphire Bandgap(300K)
eV
PL
3.44[1,2]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
(2)Xiamen Powerway Advanced Material Co. Ltd.
Electron mobility(300K)
cm2/V s
Hall effect sensor
1350[1]
150(for n=1019)[2]
240(for n=1018)[2]
500(for n=1017)[2]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
(2)Xiamen Powerway Advanced Material Co. Ltd.
Hole mobility(300K)
cm2/V s
Hall effect sensor
13[2],20[1]

(1)MTI Corp.
(2)http://www.springer.com/materials/book/978-3-642-04828-9
Melting point
K
Thermal couple
2573[1]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
Lattice constants
nm
X-ray diffraction
a=0.319;c=0.518[1]
a=0.3189;c=0.5185[2]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
(2)Xiamen Powerway Advanced Material Co. Ltd.
Thermal conductivity(300K)
W/cm K
Time-domain thermoreflectance
2.3(semi insulating)[1]; 1.7(HVPE material,n=1x1017)[1]

(1)Xiamen Powerway Advanced Material Co. Ltd.
Heat capacity
J/mol K
Constant presure heating
35.3[1]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
Elastic modulus
GPa
Mechanical measurement
210[1]

(1)http://www.springer.com/materials/book/978-3-642-04828-9
Dislocation density
/cm2
TEM and XRD
≤1 x 108[1,2,5,7]
5 x 108-6 x 108(for N type and undoped)[3]
8 x 108(for semi insulating)[3]
8 x 107-9 x 107(for N type and undoped)[4]
5 x 108-3 x 107(for N type,Semi insulating and undoped)[6]

(1)Xiamen Powerway Advanced Material Co., Ltd.
(2)Anhui Haibei Import & Export Co., Ltd.
(3)Saint-Gobain Crystals-Photonic Materials
(4)Saint-Gobain Crystals-Photonic Materials
(5)Precision Micro-Optics LLC
(6)RF-Lambda USA LLC
(7)Atecom Technology Co., Ltd.
Sheet carrier density
/cm2
SIMS
N/A


Sheet resistance/Resistivity
ohm-cm

<0.05(Undoped)[1,7,11]

(1)Xiamen Powerway Advanced Material Co., Ltd.
(2)Anhui Haibei Import & Export Co., Ltd.
(3)Precision Micro-Optics LLC
(4)MTI Corp.
(5)MTI Corp.
(6)MTI Corp.
(7)RF-Lambda USA LLC
(8)RF-Lambda USA LLC
(9)RF-Lambda USA LLC
(10)Atecom Technology Co., Ltd.
(11)Kyma Technologies
<0.05(N type)[1,2,3,5,10],.001-.01[8]

<1(P type)[1]
3-5(P type)[4]

>106(Semi insulating)[1,2,3,6,10],109-1012(Semi insulating)[9]

Carrier concentration
/cm3
SIMS
~1019(N type)[4]
1x1018-3x1018(N type)[2]
~1018(N type)[6]
1018(N type)[7]

(1)Xiamen Powerway Advanced Material Co., Ltd.
(2)Saint-Gobain Crystals-Photonic Materials
(3)MTI Corp.
(4)MTI Corp.
(5)RF-Lambda USA LLC
(6)RF-Lambda USA LLC
(7)Kyma Technologies
~1017(P type)[1]
1017-3x1018(P type)[3]
5x1017(P type)[7]

3x1017(undoped)[2]
<2x1017(undoped)[5]
1016(undoped)[7]

Thickness(epilayer)
um
Ellipsometry
3-100(N type,undoped)[1,2,3,4,5,6]

(1)Xiamen Powerway Advanced Material Co., Ltd.
(2)Anhui Haibei Import & Export Co., Ltd.
(3)Saint-Gobain Crystals-Photonic Materials
(4)Precision Micro-Optics LLC
(5)RF-Lambda USA LLC
(6)Atecom Technology Co., Ltd.
5-100(P type)[1]

20-90(Semi insulating)[1,2,3,6]

Buffer layer(sapphire) thickness
um
Ellipsometry
430[1,3],330[2]

(1)Xiamen Powerway Advanced Material Co., Ltd.
(2)Saint-Gobain Crystals-Photonic Materials
(3)MTI Corp.
Misorientation
deg
SEM and TEM
On demand


Macro defect density
/cm2
TEM and XRD
<5[1,3], <10[2]

(1)MTI Corp.
(2)RF-Lambda USA LLC
(3)Kyma Technologies
Bow
um
SEM or AFM
10-500[1]

(1)RF-Lambda USA LLC
Total thickness variation (TTV)
um
AFM(prefered)and SEM
<10


Surface roughness
nm
Profilometer and AFM
RMS~10[1],Ra<0.2;RMS<0.5(epi ready)

(1)MTI Corp.
Thermal expansion coeff(300K)
/K
Thermal elaastic measurement
along a0:5.59x10-6[1]; along c0:7.75x10-6[1]

(1)Xiamen Powerway Advanced Material Co. Ltd.
Dielectric constant(300K)

Ellipsometry
along a0:10.4[1]; along c0:9.5[1]

(1)Xiamen Powerway Advanced Material Co. Ltd.
Refractive index

Ellipsometry
2.67 at 3.38eV[1]

(1)Xiamen Powerway Advanced Material Co. Ltd.
Electron Effective mass


0.22[1]

(1)Xiamen Powerway Advanced Material Co. Ltd.
FWHM of(102)XRD arcsec

X-ray diffraction
<250[1],~350[2],<300[3]

(1)Xiamen Powerway Advanced Material Co., Ltd.
(2)MTI Corp.
(3)RF-Lambda USA LLC
FWHM of(002)XRD arcsec

X-ray diffraction
<150[1],~250[2]

(1)Xiamen Powerway Advanced Material Co., Ltd.
(2)MTI Corp.
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