Figures of Merit for GaN substrates
Bulk Type | Conduction Type | Property | Units | Characterization Method | Industry range | Goal | Reference/hyperlink | ||||
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GaN Freestanding Substrate | N- type (Si doped or undoped) | Bandgap |
eV |
PL |
3.44 |
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Electron mobility |
cm2/V s |
1350(300K) |
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Hole mobility |
cm2/V s |
13(300K) |
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Melting point |
K |
thermal couple |
2573 |
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Lattice constants |
nm |
X-ray diffraction |
a=0.319;c=0.518 |
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Thermal conductivity |
W/cm K |
2.1 |
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Heat capacity |
J/mol K |
35.3 |
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Elastic modulus |
GPa |
210 |
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Dislocation density |
/cm2 |
210 |
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Sheet carrier density |
/cm2 |
210 |
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Sheet resistance |
ohm-cm |
210 |
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Doping concentration |
/cm3 |
210 |
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Thickness |
um |
210 |
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Misorientation |
deg |
210 |
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Macro defect density |
/cm2 |
210 |
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Bow |
um |
210 |
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Total thickness variation (TTV) |
um |
210 |
RMS roughness |
nm |
210 |