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*Maskless lithography utilizes methods that directly transfer the information onto the substrate, without utilizing an intermediate static mask, i.e. photomask that is directly replicated. In microlithography typically radiation transfer casts an image of a time constant mask onto a photosensitive emulsion (or photoresist). | *Maskless lithography utilizes methods that directly transfer the information onto the substrate, without utilizing an intermediate static mask, i.e. photomask that is directly replicated. In microlithography typically radiation transfer casts an image of a time constant mask onto a photosensitive emulsion (or photoresist). | ||
*The concept takes advantage of high speed or parallel manipulation technologies that have been enabled by large and cheap available computing capacity, which is not an issue with the standard approach that decouples a slow, but precise structuring process for writing a mask from a fast and highly parallel copy process to achieve high replication throughputs as demanded for in industrial microstructuring. | *The concept takes advantage of high speed or parallel manipulation technologies that have been enabled by large and cheap available computing capacity, which is not an issue with the standard approach that decouples a slow, but precise structuring process for writing a mask from a fast and highly parallel copy process to achieve high replication throughputs as demanded for in industrial microstructuring. | ||
==Market Survey== | |||
*Traditional photolithography calls for the fabrication or purchase of a photomask and the use of a stepper or mask aligner to transfer the CAD-pattern onto the resist-covered wafer or plate. At this point in time, the well-established photomask process is indeed the only feasible way for high volume manufacturing of sub-micron sized design features. | |||
*Another photolithography technique available which constitutes the perfect tool for many other applications: ''Maskless photolithography''. In maskless photolithography the pattern is exposed directly onto the substrate surface with the help of a spatial light modulator (SLM) – which serves essentially as a programmable mask. The system takes your design file and simply “writes” the pattern onto the resist-covered substrate. | |||
*Direct-write process puts you in a position to skip the entire time-consuming and expensive photomask process and all it involves: Instead, you can redesign your CAD-drawing (again and again, if necessary) and immediately re-expose the pattern. | |||
''Reference'' :[https://heidelberg-instruments.com/en/features-technologies/key-features/maskless-lithography.html Heidelberg-instruments] | |||
[https://heidelberg-instruments.com/en/products/mla300.html] | |||
==List of References== | |||
===[https://ieeexplore.ieee.org/document/8376878 <font color="Darkblue"> Cost effective maskless lithography: Direct UV laser writing of microstructures for microfluidics applications</font>]=== | |||
Mohammed Ziauddin ; Abdel-Hamid I. Mourad ; Saud A. Khashan | |||
*In this study, cost effective measures are taken in selecting each component in building the system. | |||
*Main components that took larger share of the cost are the XY linear stage, software, stepper motors and drivers, and power supply. | |||
*In this study, the maskless lithography system is developed based on UV laser writing tool and simultaneously moving XY linear stage | |||
===[https://ir.library.louisville.edu/cgi/viewcontent.cgi?article=2127&context=etd <font color="Darkblue"> A programmable mask for dir ammable mask for direct write lithogr ect write lithography</font>]=== | |||
Kunal Pharas 1979-University of Louisville | |||
*This project aims at designing and fabricating a programmable mask for a direct write lithography system which can achieve higher throughput at a reasonable cost for the semiconductor industry in the future. | |||
*The device has apertures of different sizes which can be used as programmable masks by opening and closing the shutters over them. | |||
*The optical image of the developed photoresist that was exposed through the apertures resembles almost identical feature size and linewidth measurement of the pattern exposed | |||
Revision as of 05:16, 13 October 2020
Literature review : Direct Laser Writer for Maskless Lithography System
Background
Searches
- Google search for Maskless Lithography
- Wikipedia
Mask Aligner/Aligner
Wikipedia:[1]
- Maskless lithography utilizes methods that directly transfer the information onto the substrate, without utilizing an intermediate static mask, i.e. photomask that is directly replicated. In microlithography typically radiation transfer casts an image of a time constant mask onto a photosensitive emulsion (or photoresist).
- The concept takes advantage of high speed or parallel manipulation technologies that have been enabled by large and cheap available computing capacity, which is not an issue with the standard approach that decouples a slow, but precise structuring process for writing a mask from a fast and highly parallel copy process to achieve high replication throughputs as demanded for in industrial microstructuring.
Market Survey
- Traditional photolithography calls for the fabrication or purchase of a photomask and the use of a stepper or mask aligner to transfer the CAD-pattern onto the resist-covered wafer or plate. At this point in time, the well-established photomask process is indeed the only feasible way for high volume manufacturing of sub-micron sized design features.
- Another photolithography technique available which constitutes the perfect tool for many other applications: Maskless photolithography. In maskless photolithography the pattern is exposed directly onto the substrate surface with the help of a spatial light modulator (SLM) – which serves essentially as a programmable mask. The system takes your design file and simply “writes” the pattern onto the resist-covered substrate.
- Direct-write process puts you in a position to skip the entire time-consuming and expensive photomask process and all it involves: Instead, you can redesign your CAD-drawing (again and again, if necessary) and immediately re-expose the pattern.
Reference :Heidelberg-instruments [2]
List of References
Cost effective maskless lithography: Direct UV laser writing of microstructures for microfluidics applications
Mohammed Ziauddin ; Abdel-Hamid I. Mourad ; Saud A. Khashan
- In this study, cost effective measures are taken in selecting each component in building the system.
- Main components that took larger share of the cost are the XY linear stage, software, stepper motors and drivers, and power supply.
- In this study, the maskless lithography system is developed based on UV laser writing tool and simultaneously moving XY linear stage
A programmable mask for dir ammable mask for direct write lithogr ect write lithography
Kunal Pharas 1979-University of Louisville
- This project aims at designing and fabricating a programmable mask for a direct write lithography system which can achieve higher throughput at a reasonable cost for the semiconductor industry in the future.
- The device has apertures of different sizes which can be used as programmable masks by opening and closing the shutters over them.
- The optical image of the developed photoresist that was exposed through the apertures resembles almost identical feature size and linewidth measurement of the pattern exposed