Articles
K. Gilleo et. al. Thermoplastic Injection Molding: New Packages and 3D Circuits Proceedings of the 10th Electronic Circuit World Convention, Anaheim, USA. 2005
K. Gilleo et. al. Thermoplastic Injection Molding: New Packages and 3D Circuits Proceedings of the 10th Electronic Circuit World Convention, Anaheim, USA. 2005