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* Further analysis is conducted to determine the optimum weld strength based upon LASERLINE parameters | * Further analysis is conducted to determine the optimum weld strength based upon LASERLINE parameters | ||
===[http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1441331&tag=1 Fabrication of multilayered microfluidic 3D polymer packages <ref>Garst, Sebastiaan, Matthias Schuenemann, Matthew Solomon, Micah Atkin, and Erol Harvey. "Fabrication of multilayered microfluidic 3D polymer packages." In Electronic Components and Technology Conference, 2005. Proceedings. 55th, pp. 603-610. IEEE, 2005.</ref>]=== | |||
===[ <ref></ref>]=== | |||
'''Abstract:''' | '''Abstract:''' | ||
The realization of microfluidic packages by stacking and bonding several layers of microstructured polymer films opens up the potential of creating complex three-dimensional microfluidic structures based on relatively simple two-dimensional manufacturing processes. Whereas a multitude of microstructuring techniques have been developed, packaging and bonding technologies for multilayer microfluidic devices are still underrepresented. Bulk bonding processes like thermal diffusion bonding fit well into a lab environment, but feature extensive bonding times. With increasing fluidic complexity, bonding technologies that enable selective bonding and sealing at pre-selected areas (e.g. around channel walls or process chambers) are required. Selective bonding technologies enable a localized heat generation exactly at the desired bond position and thus significantly reduce the risk of structure deformation and channel clogging. In this paper, experimental results for a variety of bulk and selective bonding methods are reported and compared. Surface modification of polymers and lasers welding of polymer sheets are identified as suitable technologies for integration with high-throughput production environments. | |||
'''Keywords:''' | '''Keywords:''' | ||
biomedical materials, bonding processes, laser beam welding, microfluidics, plastic packaging, polymer films | |||
'''Summary:''' | |||
* Author proposes the development of 3D micro fluid channels by application of 2D manufacturing processes for biomedical applications. | |||
* Microfluid channels are realized by stacking of polymer films. Proper adhesion methods have been analyzed. | |||
* LDPE has been investigated | |||
===[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?reload=true&arnumber=7048377 Simulation of laser structuring by three dimensional heat transfer model <ref>Bachyl, Bassim, and Joerg Franke. "Simulation of laser structuring by three dimensional heat transfer model." In Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International, pp. 437-444. IEEE, 2014.</ref>]=== | |||
'''Abstract:''' | |||
In this study, a three dimensional numerical heat transfer model has been used to simulate the laser structuring of polymer substrate material in the Three-Dimensional Molded Interconnect Device (3D MID) which is used in the advanced multi-functional applications. A finite element method (FEM) transient thermal analysis is performed using APDL (ANSYS Parametric Design Language) provided by ANSYS. In this model, the effect of surface heat source was modeled with Gaussian distribution, also the effect of the mixed boundary conditions which consist of convection and radiation heat transfers have been considered in this analysis. The model provides a full description of the temperature distribution, as well as calculates the depth and the width of the groove upon material removal at different set of laser parameters such as laser power and laser speed. This study also includes the experimental procedure to study the effect of laser parameters on the depth and width of the removal groove metal as verification to the modeled results. Good agreement between the experimental and the model results is achieved for a wide range of laser powers. It is found that the quality of the laser structure process is affected by the laser scan speed and laser power. For a high laser structured quality, it is suggested to use laser with high speed and moderate to high laser power. | |||
'''Keywords:''' | |||
Gaussian distribution, finite element analysis, heat transfer, injection moulding, integrated circuit interconnections, laser beam welding, polymers, temperature distribution, thermal analysis, thermal management (packaging), transient analysis | |||
'''Summary:''' | '''Summary:''' | ||
* Laser structuring i.e. sintering/melting modeled with a Gaussian distribution utilizing mixed boundary conditions of convection and radiative heat transfer. | |||
==References== | ==References== | ||
[[category:MOST literature reviews]] | [[category:MOST literature reviews]] | ||
Revision as of 01:41, 3 May 2016
Background
This page is dedicated to the literature review an Open Source Polymer Welder. Refer to MOST: Open-source_laser_system_for_polymeric_welding for further information.
Literature
Computer Simulation for Laser Welding of Thermoplastic Polymers [1]
Abstract: This paper presents an analytical approach to thennal behaviors of laser welding of polymers. Laser polymers processing leads to various thennal, photophysical, and photochemical processes within the bulk and on the material surface. The understanding of these processes is beneficial to obtaining the high quality precision engineering of polymers. The Green's function of a multi-layer plate for the transient heat transfer is utilized to analyze the laser welding of PMMA and ABS/PC. The results indicate that the measured temperatures agree well with the calculated temperatures near laser source. The model proposed by this paper is applicable to the temperature prediction of the laser welding for polymers.:
Keywords: Green's function methods, heat transfer, laser beam welding, polymers, thermal analysis, ABS/PC, Green's function, PMMA, computer simulation, temperature prediction, thermal analysis, thermal
Summary:
- Linear laser welding of ABS/PMMA systems
- Numerical modeling simulations
- Determination of critical surface temperatures for welding. Calculations correlate to experimentally acquired data.
Laser welding of thin polymer ®lms to container substrates for aseptic packaging [2]
Abstract: Keyhole laser welding of polymers is a subject well covered and researched, but relatively little information exists regarding the welding of thin polymer ®lms, particularly to a heavier substrate. This paper presents the design of a suitable test apparatus for laser welding thin ®lm to a heavier substrate, and shows the results of an investigation into the feasibility of laser welding multi-layer polymer ®lm lids to tubs for the manufacture of aseptic food containers. A consistent weld, free from defects, is the key to process success. Typical welding defects have been synthesised in order to investigate, and consequently remove, their cause. The result is a reliable welding method based on even ®lm clamping. With careful attention to machine design, a seal of high mechanical strength and chemical integrity is possible. 7 2000 Elsevier Science Ltd. All rights reserved.
Keywords: Laser, Welding, Polymer
Summary:
- Design and implementation of weld apparatus for thin film adhesion to thick substrate.
- Characterization of mechanical strength and chemical integrity
- Non-Contact Sealing
- Gaussian Weld Effect Region
- Peel adhesion testing
Industrial applications of high power diode lasers in materials processing [3]
Abstract: Diode lasers are widely used in communication, computer and consumer electronics technology. These applications are based on systems, which provide power in the milliwatt range. However, in the mean time high power diode lasers have reached the kilowatt power range. This became possible by special cooling and mounting as well as beam combination and beam forming technologies. Such units are nowadays used as a direct source for materials processing. High power diode lasers have entered the industrial manufacturing area [Proceedings of the Advanced Laser Technologies Conference 2001, Proc. SPIE, Constanta, Romania, 11–14 September 2001].
Keywords: Diode lasers, Materials processing, Welding, Brazing, Cladding, Surface treatment, Soldering
Summary:
- Diode laser market coverage ~two-thirds
- Diode lasers are lightweight, small, reliable and efficient thus making them practically suited to many applications
- Significant discussion on the process of laser diode systems
- Industrial application examples
Review of techniques for on-line monitoring and inspection of laser welding [4]
Abstract: Laser welding has been applied to various industries, in particular, automotive, aerospace and microelectronics. However, traditional off-line testing of the welds is costly and inefficient. Therefore, on-line inspection systems with low cost have being developed to increase productivity and maintain high welding quality. This paper presents the applications of acoustic, optical, visual, thermal and ultrasonic techniques and latest development of laser welding monitoring. The advantages and limitations of these techniques are also discussed.
Keywords: Laser welding inspection, efficiency, increased productivity
Summary:
- Article discussed optimization of effective / cost efficient weld inspection techniques
- Including; acoustic, optical, visual, thermal and ultrasonic techniques
- Development of in-line inspection equipment to maintain quality and increase productivity
Theoretical analysis of photodiode monitoring of laser welding defects by imaging combined with modelling [5]
Abstract: On-line process monitoring of laser welding defects by detecting characteristic changes of the process emissions via photodiodes has high potential but, due to the complex process, lack of directly interpretable and thus controllable correlations. Deep analysis of the process by high speed imaging in combination with modelling enables one to discuss the correlations between the signal and the process, as was demonstrated for quasi-steady state conditions and for transient phenomena. Despite improved knowledge through the study, several uncertainties like the emissivity, the keyhole radiation characteristics and the temperature field need to be identified more accurately for a complete theoretical description of the signal causes.
Keywords: Photodiode, laser-welding, on-line processing
Summary:
- Article proposes a method to monitor quality of laser welds based upon measurement of process emissions.
- Modeling and image processing has developed a correlation the emission signal and (weld) process results.
- Measurements of weld width "top down" and cross-sectional analysis.
Laser welding of polymers [6]
Abstract: Deep penetration welding and cutting of metals can be carried out at high speed with relatively low laser power. The efficient coupling of the laser radiation to the metal is due to the formation of a "keyhole." Over the years, an attempt has been made to transfer the results on metals to plastics. It will be shown here that keyhole welding of plastics is limited to the very restricted set of plastics that have a boiling point. Volume heating, a mechanism that is not applicable to metals, is restricted to plastics with a good transparency for the incident radiation and with a high optical quality. Finally, surface heating is shown to be the most common mechanism for heating plastics.
Keywords: None Available
Summary:
- Article discusses technological challenges associated with polymer welding; keyhole, absorption and radiation heating.
Diode laser welding of ABS: Experiments and process modeling [7]
Abstract: The laser beam weldability of acrylonitrile/butadiene/styrene (ABS) plates is determined by combining both experimental and theoretical aspects. In modeling the process, an optical model is used to determine how the laser beam is attenuated by the first material and to obtain the laser beam profile at the interface. Using this information as the input data to a thermal model, the evolution of the temperature field within the two components can be estimated. The thermal model is based on the first principles of heat transfer and utilizes the temperature variation laws of material properties. Corroborating the numerical results with the experimental results, some important insights concerning the fundamental phenomena that govern the process could be extracted. This approach proved to be an efficient tool in determining the weldability of polimeric materials and assures a significant reduction of time and costs with the experimental exploration.
Keywords: Laser welding, Semitransparent polymers, Experimental design
Summary:
- Describes the optical and thermal characteristics of ABS
- Optical and Thermal Processing models are developed and compared to preliminary testing
- Further analysis is conducted to determine the optimum weld strength based upon LASERLINE parameters
Fabrication of multilayered microfluidic 3D polymer packages [8]
Abstract: The realization of microfluidic packages by stacking and bonding several layers of microstructured polymer films opens up the potential of creating complex three-dimensional microfluidic structures based on relatively simple two-dimensional manufacturing processes. Whereas a multitude of microstructuring techniques have been developed, packaging and bonding technologies for multilayer microfluidic devices are still underrepresented. Bulk bonding processes like thermal diffusion bonding fit well into a lab environment, but feature extensive bonding times. With increasing fluidic complexity, bonding technologies that enable selective bonding and sealing at pre-selected areas (e.g. around channel walls or process chambers) are required. Selective bonding technologies enable a localized heat generation exactly at the desired bond position and thus significantly reduce the risk of structure deformation and channel clogging. In this paper, experimental results for a variety of bulk and selective bonding methods are reported and compared. Surface modification of polymers and lasers welding of polymer sheets are identified as suitable technologies for integration with high-throughput production environments.
Keywords: biomedical materials, bonding processes, laser beam welding, microfluidics, plastic packaging, polymer films
Summary:
- Author proposes the development of 3D micro fluid channels by application of 2D manufacturing processes for biomedical applications.
- Microfluid channels are realized by stacking of polymer films. Proper adhesion methods have been analyzed.
- LDPE has been investigated
Simulation of laser structuring by three dimensional heat transfer model [9]
Abstract: In this study, a three dimensional numerical heat transfer model has been used to simulate the laser structuring of polymer substrate material in the Three-Dimensional Molded Interconnect Device (3D MID) which is used in the advanced multi-functional applications. A finite element method (FEM) transient thermal analysis is performed using APDL (ANSYS Parametric Design Language) provided by ANSYS. In this model, the effect of surface heat source was modeled with Gaussian distribution, also the effect of the mixed boundary conditions which consist of convection and radiation heat transfers have been considered in this analysis. The model provides a full description of the temperature distribution, as well as calculates the depth and the width of the groove upon material removal at different set of laser parameters such as laser power and laser speed. This study also includes the experimental procedure to study the effect of laser parameters on the depth and width of the removal groove metal as verification to the modeled results. Good agreement between the experimental and the model results is achieved for a wide range of laser powers. It is found that the quality of the laser structure process is affected by the laser scan speed and laser power. For a high laser structured quality, it is suggested to use laser with high speed and moderate to high laser power.
Keywords: Gaussian distribution, finite element analysis, heat transfer, injection moulding, integrated circuit interconnections, laser beam welding, polymers, temperature distribution, thermal analysis, thermal management (packaging), transient analysis
Summary:
- Laser structuring i.e. sintering/melting modeled with a Gaussian distribution utilizing mixed boundary conditions of convection and radiative heat transfer.
References
- ↑ C. Y. Ho, M. Y. Wen and C. Ma, "Computer Simulation for Laser Welding of Thermoplastic Polymers," Computer Engineering and Applications (ICCEA), 2010 Second International Conference on, Bali Island, 2010, pp. 362-364.
- ↑ Brown, N., Kerr, D., Jackson, M. R., & Parkin, R. M. (2000). Laser welding of thin polymer films to container substrates for aseptic packaging.Optics & laser technology, 32(2), 139-146. Chicago
- ↑ Bachmann, Friedrich. "Industrial applications of high power diode lasers in materials processing." Applied surface science 208 (2003): 125-136.
- ↑ Shao, Jiaqing, and Yong Yan. "Review of techniques for on-line monitoring and inspection of laser welding." Journal of Physics: Conference Series. Vol. 15. No. 1. IOP Publishing, 2005.
- ↑ Norman, P., H. Engström, and A. F. H. Kaplan. "Theoretical analysis of photodiode monitoring of laser welding defects by imaging combined with modelling." Journal of Physics D: Applied Physics 41.19 (2008): 195502.
- ↑ Nonhof, C. J. "Laser welding of polymers." Polymer engineering and science 34.20 (1994): 1547.
- ↑ Ilie, Mariana, Eugen Cicala, Dominique Grevey, Simone Mattei, and Virgil Stoica. "Diode laser welding of ABS: Experiments and process modeling." Optics & Laser Technology 41, no. 5 (2009): 608-614.
- ↑ Garst, Sebastiaan, Matthias Schuenemann, Matthew Solomon, Micah Atkin, and Erol Harvey. "Fabrication of multilayered microfluidic 3D polymer packages." In Electronic Components and Technology Conference, 2005. Proceedings. 55th, pp. 603-610. IEEE, 2005.
- ↑ Bachyl, Bassim, and Joerg Franke. "Simulation of laser structuring by three dimensional heat transfer model." In Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International, pp. 437-444. IEEE, 2014.