Line 93: Line 93:
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.
The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:
*CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
*Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.
*Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
*Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
*Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.


===Light===
*Calibrated light source --  Ocean Optics DH-2000-CAL. It is a UV-VIS-NIR light source with two lamps, a deuterium and a halogen lamp..
*Calibrated light source --  Ocean Optics DH-2000-CAL. It is a UV-VIS-NIR light source with two lamps, a deuterium and a halogen lamp..
* Several Ocean Optics portable spectrometers covering UV to NIR -- all of which are usb digital with the full software licenses.
* Several Ocean Optics portable spectrometers covering UV to NIR -- all of which are usb digital with the full software licenses.

Revision as of 19:23, 18 February 2019

Michigan Tech's Open Sustainability Technology LabContact Dr. Joshua Pearce at Free Appropriate Sustainable Technology.
MOST · Projects & Publications · Methods · Lit. reviews · People · Sponsors · News · Updates on Twitter · YouTube
Read more...

This category contains lab protocols for the Michigan-Tech Open Sustainability Technology (MOST) Research Group. 

A note on safety: MOST researchers never do anything you feel is unsafe. If any experiment makes you even remotely uncomfortable go to talk to Dr. Pearce about it immediately.
Open Source Research
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Naming convention

  • List the title of your protocol then :MOST (not MOST first- so things are easy to find in this category) - First word is capitalized but all others are lower cased.

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Useful software

Facilities at MTU

Outreach after

OS Videos

MOST Research Facilities

Space

The Pearce group has been allotted two rooms of research space on the 4th and 5th floors of the M&M Building at Michigan Technological University. The space consists of 2 clean hoods, 2 standard fume hoods, and bench top workspace for more than a dozen specialized pieces of equipment and work areas. In addition all metal 3-D printing occurs in 3 bays of fume hood on the 3rd floor lab.

Computers

The Pearce group laboratories are equipped with 5 Linux-based computers and 5 PC-compatible computers that run up-to-date software for word processing, graphics, engineering design and data manipulation. All computers have Internet connections though hi-speed Ethernet ports or wireless and connect to a laser printer and copier in the offices. In addition, all 3D printers in the Pearce lab have a stand-alone computer/microcomputer of some kind.

Offices

All graduate students have shared office space as part of the MSE and ECE programs. Each student has a desk, which are equipped with Ethernet ports and each office has file cabinets for storage, as well as access to shared printers. The PI has an office down the hall from the main laboratory on the 5th floor with sufficient space for scientific discussions with 3 students and has access to numerous conference rooms within the building for group meetings.

Rapid Prototyping Facilities

Mechanical

The Pearce laboratory is fully stocked with standard electrical and mechanical equipment for open-source rapid prototyping using 3-D printing including approximately a dozen open source RepRap printers of MTU design (e.g. MOST deltas or 4 heavily modified Mendell/Prusa-style RepRap printers), 2 Gigabots (one highly modified), a Gigabot X, CNC R printers, and over 30 Lulzbot Taz, and miniTaz printers.In addition we have 5 OS metal 3-D printers that use GMAW technology as well as sever syringe printers, slot die, and wax printers.

In addition, MTU developed the first RecycleBots and has approximately six different versions of these waste plastic extruders and some commercial variants for testing. We also have an open source chopper for making composite filament.

Electronics

Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department. The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:

  • CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
  • Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers. Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.

The Michigan Tech Department of Electrical and Computer Engineering has extensive design and electronic test resources available. These include:

  • CNC based printed circuit board prototype production capabilities with 5 mil feature resolution.
  • Extensive resources for electronic test equipment including numerous digital volt-ohmmeters, Keithley and Agilent DMM and electrometers, current model Agilent 40MHz signal and word generators, Agilent/hp and Tektronix storage oscilloscopes ranging from 60MHz to 8GSa/s and some including digital logic analysis capabilities up to 20MHz. Numerous regulated power supplies, spectrum analyzers, network analyzers, RF test and analysis capabilities to 12GHz for multiple polarizations, two anechoic chambers.
  • Design tools including the full Cadence EDA software suit, the full Mentor Graphics EDA software suite, Eagle PCB layout, several versions of SPICE simulation capabilities, Coventorware MEMS design software, ANSYS FEA design software, Comsol Multiphysics, and the Ansoft e-mag software suite.
  • Wafer probing capabilities in the MTU Microfabrication Facility include two Micromanipulator wafer probers capable of 100mm and 200mm substrate probing down to 2 micron accuracy. Instrumentation includes a Keithley 4200-SCS semiconductor parametric analyzer with pulsed IV capabilities, a hp/Agilent 4145A semiconductor parametric analyzer, a 4284A precision LCR meter, a 4180A picoammeter, two Keithley model 220 precision current sources and two model 2400 Sourcemeters, a Keithley model 196 system DMM and two hp/Agilent 3478A multi DMMs. Many other instruments are available through the ECE department common laboratory resources for use as appropriate.
  • Wire bonding capabilities in the MTU Microfabrication Facility includes a K&S Au wedge-wedge wire bonder operating at temperatures up to 400°C.Dr. Pearce's group has the ability to do in-lab PCB design and either milling or printing on augmented 3-D printers using open source tool chains, although for bigger jobs and or any need for the microfab we use the electronic design and test facilities in the ECE department.

Light

  • Calibrated light source -- Ocean Optics DH-2000-CAL. It is a UV-VIS-NIR light source with two lamps, a deuterium and a halogen lamp..
  • Several Ocean Optics portable spectrometers covering UV to NIR -- all of which are usb digital with the full software licenses.
    • Ocean Optics USB2000 Spectrometer w/ Software (175-502nm 25uM slit)
    • Ocean Optics USB4000 spectrometer with a 300nm to 1000nm range.
    • NIRQuest 512-2.5 -- 900 – 2500 nm.
  • A collection of open-source spectrometers from Public Lab (400-700nm) and Spectruino (380-750nm).

Research Data Repository Approaches

http://blog.f1000research.com/2014/03/10/f1000research-and-the-force11-data-citation-principles/#sthash.jWLW365U.dpuf

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